esd array revision november 08, 2013 1 / 5 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESDP020604V12B3 socay electronics co., ltd. www.socay.com this specification is applied to protect sensitive electronic circuits from the threat of electrostatic discharge (esd). the function meets with the requirement of iec61000-4-2 specification. the extreme low capacitance is suit for hdmi esd protection application. according to the special property of device, we recommend not to use on such application as: dc/ac power line. u rohs compliant, lead-free u protection against esd voltages and currents (iec 61000-4-2 level 4) u extremely quick response time (<1ns) present ideal esd protection u extremely low capacitance (0.1pf typical) u extremely low leakage current u surface mount device u zero signal distortion u usb3.0 u hdmi u dvi u display port u mipi u lvds u mddi u rgb u digital video equipment u mobil phone u gps antenna u bluetooth communication equipment characteristic value rate voltage v dc (max) 12v leakage current i l (max) (@12vdc) 0.01 a trigger voltage v t 300v typical clamping voltage v c 30v typical capacitance, @1mhz c p 0.1pf typical response time <1ns esd voltage capability, iec61000-4-2 contact discharge mode 8kv esd voltage capability, iec61000-4-2 air discharge mode 15kv esd withstand pulses 1000 typical c p - device capacitance measured with 1vrms description features product model applications electrical characteristics equivalent circuits
esd array revision november 08, 2013 2 / 5 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESDP020604V12B3 socay electronics co., ltd. www.socay.com substrate ceramic (alumina) symbol spec. encapsulate polymer l 1.60 0.10 end termination ag / ni / sn w 1.00 0.10 t 0.55 0.10 b 0.20 0.10 c 0.20 0.05 d 0.50 0.05 p 0.5 p1 1.0 x 0.2 y 0.7 z 1.6 g 0.2 overcoat color: green construction & dimensions unit: mm e xplanation of part number esd p 02 0604 v12 b3 b3, mode code max rated voltage v dc , v12=12v chip size, 0604 = 0604 (eia) channels, 02 = 2 channels series type: polymer esd suppressors recommended pad outline
esd array revision november 08, 2013 3 / 5 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESDP020604V12B3 socay electronics co., ltd. www.socay.com parameter value unit operating temperature -55 to +125 c storage temperature --55 to +125 c taping package storage condition storage temperature 5 to 40 c relative humidity <65 %rh storage time 12 max month reflow condition pb free assembly pre heat -temperature min (t s(min) ) +150 c -temperature max (t s(max) ) +200 c -time (min to max) (t s ) 60 -180 seconds average ramp up rate ( liquidus temp t l ) to peak 3 c/second max t s(max) to t l - ramp-up rate 3 c/second max reflow - temperature (t l ) (liquidus) +217 c - time (min to max) (t l ) 60 -150 seconds note that this product will be easily damaged by rapid heating, rapid cooling or local heating. do not give heat shock over 100 c in the process of soldering. we recommend to take preheating and gradual cooling soldering gun procedure note the follows, in case of using solder gun for replacement. 1) the tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30w 2) the soldering gun tip shall not touch this product directly. soldering volume note that excess of soldering volume will easily get crack the body of this product. peak temperature (t p ) 260 +0/-5 c time within 5 c of actual peak temperature (t p ) 20-40 seconds ramp-down rate 6 c/second max time 25 c to peak temperature (t p ) 8 minutes max temperature specifications soldering parameters precaution for soldering precaution for soldering ramp-down preheat critical zone t l to t p time to peak temperature (t 25 to peak) t p t l t s(max) t s(min) 25 temperature ramp-up time
esd array revision november 08, 2013 4 / 5 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESDP020604V12B3 socay electronics co., ltd. www.socay.com carrier tape dimensions unit: mm symbol spec. a 8.00 0.30 b 3.50 0.05 c 1.75 0.10 d 2.00 0.05 e 4.00 0.10 f 1.50 0.10 l 1.80 0.15 packaging method - products shall be heat-sealed in the chip pocket, spacing pitch 2-mm of paper carrier tape with cover tape, and carrier tape shall be reeled to the reel. - tape material to be paper. - cover tape adhesion to be 35 25 grams. w 1.25 0.15 t 0.75 0.05 taping reel dimensions unit: mm taping specifications there shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. quantity of products in the taping package standard quantity 5000pcs / reel shipping quantity is a multiple of standard quantity packaging information
esd array revision november 08, 2013 5 / 5 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESDP020604V12B3 socay electronics co., ltd. www.socay.com hdmi block diagram hdmi interface application gnd v ideo a udio control/status v ideo a udio control/status source sink ESDP020604V12B3 gnd cec line tmds channel 0 tmds channel 1 tmds channel 2 tmds clock c hannel video audio display data channel (ddc) edid rom hdmi sink control/status video audio control/status hdmi source
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